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Global 2.5D and 3D Semiconductor Packaging Market – Growth, Trends, Impact of COVID-19, Forecast (2022)

New YorkAnd the November 18, 2022 /PRNewswire/ —

The global 2.5D and 3D semiconductor packaging market is expected to register a CAGR of 16.2% during the forecast period (2022-2027). As 5G, artificial intelligence, and high-performance computing continue to make inroads in the world, there is a growing demand for semiconductor devices that offer improved performance, lower latency, increased bandwidth, and energy efficiency, achieved through 2.5D and 3D encapsulation technologies. In recent years, 2.5D & 3D has been gaining momentum as an ideal chipset integration platform due to its advantages in achieving extremely high packaging density and energy efficiency.

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the main points
Semiconductor integrated circuits are deployed in many automotive, consumer electronics, and other industries. For example, the advent of the Internet of Things, artificial intelligence (AI), and the proliferation of high-end electronics have driven the cutting-edge applications sector across the consumer electronics and automotive industries. Since packaging is an early stage in the electronics value chain, the growth of the studied market is directly influenced by the growth of the semiconductor market.
There are many advantages to applying 2.5D & 3D IC Packaging, including Superior Orientation Density, Superior I/O Density, Homogeneous/Heterogeneous Memory, Integration of Power and Optics, Interposer Capable of Incorporating Separation Capacitor or Active Devices Enabled, Package Reliability to Meet Requirements cars, etc.
As semiconductor applications expand, a slowdown in CMOS scaling and increasing costs have forced the industry to rely on the advancement of IC packaging. 3D stacking technologies have emerged as profitable solutions that meet the performance required for applications such as artificial intelligence, machine learning, and data centers. Therefore, the growing need for HPC applications is driving the 3D-TSV market (by Silicon Via) during the forecast period.
Moreover, a pandemic like COVID-19 is expected to support the manufacturing of advanced medical devices and equipment to address such crises in the future. For example, in 2021, GE Healthcare announced that it would increase its manufacturing capacity for medical equipment, including CT scans, ultrasound machines, mobile X-ray systems, patient monitors, and ventilators, to meet the ongoing challenge of treating COVID patients. -19. . Since 2.5D and 3D semiconductor packaging has many applications in the medical industry, the spread of medical equipment manufacturing is expected to drive market growth.
However, high initial investment and increasing complexity of semiconductor integrated circuit designs are expected to constrain market development.

Major market trends

The consumer electronics sector is expected to hold Main market share

Consumer electronics is one of the primary end-user industries for semiconductor vendors. Growth in the smartphone industry, increasing adoption of smart and wearable devices, and increasing penetration of consumer IoT devices into applications such as smart homes are important factors driving the growth of the studied segment. For example, according to Ericsson, worldwide smartphone subscriptions reached 5,924 million in 2020 and 6,259 million in 2021. It is expected to reach 6,567 million in 2022 and 7,690 million in 2027.
The consumer electronics industry requires greater power dissipation, higher speeds, more pins, smaller footprints, and lower profiles. The miniaturization and integration of semiconductors has resulted in smaller, lighter and more portable devices. Each new iteration of consumer electronics products is more innovative, lighter, and more energy efficient than its predecessors. This creates massive customer expectations for the next iteration, and is an important selling point for consumer electronics producers. 2.5D and 3D semiconductor packaging technologies meet the needs of the complex and evolving consumer electronics market.
With trends like 5G smartphones, biosensors, and more AI features, the market is expected to see an increase in smartphone sales in 2022. The deployment of 5G smartphones will also greatly enhance wireless data communication bandwidth, latency, and hardware density. connected. Moreover, markets such as smart watches and smart speakers have gained great popularity in recent years, due to their increasing functionality and features with the help of advanced semiconductor components. Hence, the demand for Wi-Fi and Bluetooth chipsets skyrocketed.
Moreover, the growing market for game consoles and the increasing advances in these products are broadening the scope of the segment under consideration. Over the past 4-5 years, game consoles have become high-tech gadgets, and companies such as Sony, Microsoft, and Nintendo are increasingly investing in developing their products to reach the current eighth generation consoles.
These products use high technologies, including Blu-ray, motion sensing, VR, 4k and HD video and online functions. Therefore, these applications need chips with advanced substrate and additional functions, which motivates well-thought-out market vendors to invest in this segment. Such developments provide lucrative opportunities for the growth of the studied market.

The Asia Pacific region is expected to witness a high rate of market growth

It has made smartphone adoption rates increasing Asia Pacific One of the largest mobile markets in the world due to increasing population, increasing disposable income and increasing urbanization. For example, according to the Ministry of Industry and Information Technology (MIIT), in 2020 and 2021 there were about 112 and 116 mobile phone subscriptions per hundred inhabitants in China, Straight. The increasing smartphone penetration rate in the region is a significant growth driver for the studied market.
Memory is an important market in modern data-centric societies, underpinned by important megatrends such as mobility, cloud computing, artificial intelligence, and the Internet of Things. Chinese memory densification, chip RAM growth, and 3D stacking technologies open up great opportunities for packaging operators.
In addition, the region is expected to witness rapid growth due to the increasing demand for microcircuits, semiconductor manufacturers, OEMs and OEMs.
Moreover, countries in the region have begun to reorganize supply chains to prioritize their needs, making them resist fierce competition. The region is also making proactive investments to further strengthen its local industrial ecosystem, so that it cannot be shaken by external shocks.
For example, in May 2021And the South Korea Announce a spending plan 450 billion US dollars Over the next ten years on new semiconductor manufacturing capabilities. Semiconductors are Korea’s largest exports, mostly DRAM and NAND Flash memory products. The new plan aims to enhance the capacity of the country’s advanced logic chip foundry.

Competitive scene

The global 2.5D and 3D semiconductor packaging market is segmented due to the presence of several important players such as ASE Group, Amkor Technology Inc. and Siliconware Precision Industries Co., Ltd. Ltd (SPIL), etc. Market players must constantly innovate advanced and comprehensive products to stay relevant.

June 2021 Taiwan’s leading semiconductor foundry, TSMC, has announced plans to set up an R&D center in Japan’s Tsukuba Science City to develop 3D IC packaging materials in collaboration with its Japanese suppliers. in May 2021The Japanese Ministry of Economy, Trade and Industry (METI) and its affiliated organization, the National Institute of Advanced Industrial Science and Technology (AIST), announced that more than 20 Japanese companies will work with TSMC Japan’s 3D IC R&D Center.
July 2021 The Singapore Agency for Science, Technology and Research (A*STAR’s) Institute of Microelectronics (IME) has announced a collaboration with four important industry players to form the System-in-Package (SiP) consortium. IME will collaborate with Asahi-Kasei, GLOBALFOUNDRIES, Qorvo and Toray to develop high-density SiP for heterogeneous chip integration to meet the semiconductor industry’s challenges for 5G applications. The consortium will benefit from IME’s expertise in FOWLP / 2.5D / 3D packaging.

Additional benefits:

Market Estimation (ME) sheet in Excel format
3 months of analytics support

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