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MediaTek’s Dimensity 9200 brings ray tracing and Wi-Fi 7 to smartphones

MediaTek’s new flagship chipset not only has a more powerful CPU, GPU and GPU, but also supports 5G sub-6GHz and 5GHz networks.

Media Tech It announced Dimensity 9200 as its new flagship processor, which will power the next generation of flagship smartphones. The Dimensity 9000 series is MediaTek’s flagship line of processors. Announced last year, it includes Dimensity 9000 and Dimensity 9000 Plus. The two chipsets compete with Qualcomm’s Snapdragon 8 Gen 1 and Snapdragon 8+ Gen 1.

Qualcomm may have its chipset in a wider product range than Qualcomm, but MediaTek is keeping it on its toes. The Dimensity 9000 processor has outperformed the Snapdragon 8 Gen 1, and that battle is expected to continue with this new generation of processor. Although MediaTek announced its 2022 flagship processor first, Qualcomm isn’t far behind as the Snapdragon 8 Gen 2 chipset is slated to launch at the Snapdragon Summit starting on November 15.

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Dimensity 9200 is a 4nm chipset created by TSMC, it has eight CPU cores in 1 + 3 + 4 configuration. The core core is Cortex-X3, and its speed is 3.05GHz. MediaTek says it’s the first chip to feature a Cortex-X3 over 3GHz, and there are also three Cortex-A715 performance cores clocked at 2.85GHz and four Cortex-A510 power efficiency cores clocked at 1.8GHz. The new MediaTek chipset also features ARM’s new Immortalis-G715 GPU, which has a hardware-based ray tracing engine. Additionally, the chipmaker’s signature HyperEngine gaming technology is also present in its 6th generation form for fast, immersive gaming.

They may appear in the folds as well

Moreover, the Dimensity 9200’s Imagiq 890 image signal processor should improve images because it natively supports RGBW sensors. MediaTek says phones powered by its chips will be able to avoid a Bayer shift and save up to 34 percent more power than competing chips. There is also a new AI Processing Unit (APU) which is 35 percent faster than the 5th generation APU. Another interesting feature is Wi-Fi 7 support. This makes Dimensity 9200 the first Wi-Fi 7 ready chipset on the market. Finally, the Dimensity 9200 launched with support for sub-6GHz and mmWave 5G, which is good news for those based in the US. The spec sheet also mentions support for LPDDR5X RAM, UFS 4.0, and Bluetooth LE Audio.

MediaTek says the Dimensity 9200 will power the next generation of smartphones.It comes in a variety of stylish and foldable form factors.“The last part of the statement is interesting, as the MediaTek processor has not yet appeared in a foldable smartphone even though this category of device is already in its fourth year. All Samsung foldable smartphones are powered by Qualcomm’s Snapdragon processors. Same goes for all brands Others that launched foldable smartphones, such as Motorola, Xiaomi, Oppo and Vivo.The only exception is Huawei, whose foldable smartphones Mate X and Mate Xs were launched with Kirin processors.

Although Samsung Qualcomm is not expected to drop MediaTek for its next-generation foldable smartphones, it is likely that the first MediaTek-powered foldable smartphone will be announced by a Chinese manufacturer. your media It revealed that the first smartphones powered by Dimensity 9200 technology will be on market shelves by the end of 2022, but it is not known whether they are from Oppo, Asus, Xiaomi or Vivo, as they all confirmed their possession of phones running the operating system. Slides under development.

Source: MediaTek

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